Good Thermal Conductivity Phase Change Thermal Pad 5.0W Phase Change Material For Data Lnfrastructure
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
TIC®805G-ST Series phase change thermal pad is a type of phase change composite material specificallydesigned for applications requiring repeated assembly, such as filling the gaps between removable opticalmodules and heat sinks. lt delivers excellent thermal conductivity and tacky adhesion for easy attachment toheat sinks. In addition, its specially engineered thermal film composite can withstand repeated insertion andremoval of optical modules without tearing, effectively protecting the surfaces of both the heat sink and theoptical module while minimizing thermal resistance.TIC800G-ST series provides an outstanding thermalmanagement solution for high-power optical modules,and its standard sizes are designed to meet thethermal design requirements of most optical modules.
Features
> Good thermal conductivity
> Durable, abrasion-resistantsurface
> Optimized tack for efficienthandling
> Excellent surface wettabilitywith low interface resistance
Applications
> Optical module
> Servers, Switchs, Routers
> Data Infrastructure
> Network cabinets
| Typical Properties of TIC®800G Series |
| Product Name | TIC®805G | Test Method |
| Color | Gray | Visual |
| Thickness | 0.005" | ASTM D374 |
| (0.127mm) |
| Density | 2.6g/cc | ASTM D792 |
| Recommended Operating Temperature (℃) | -40℃～125℃ | Ziitek Test Method |
| Phase Change Softening Temperature(℃) | 50℃~60℃ | Ziitek Test Method |
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 |
| Thermal Impedance(℃-cm²/W) @50 psi | 0.014 | ASTM D5470 |
Standard Thickness:
0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254 mm),0.012" (0.305 mm)
For other thickness options, please contact us.
Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800G series is supplied with a white release liner and backing pad.
Die-cutting with half-cut processing can include pull tabs.custom-shaped samples are also available.
Pressure-Sensitive Adhesive. lt is not applicable to TIC®800G series products.
Reinforcement Material: No reinforcement materialrequired.
Independent R&D team
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